
Explore how thermal challenges arise in modern electronics, apply engineering principles to design heat sinks, and manage junction temperatures with thermal imaging for devices from phones to satellites.
Explore the fundamentals of thermal management, from heat generation and flow to junction temperature calculation, then apply heat sinks, fans, and thermal interface materials through real-world case studies.
Examine how heat travels through chip layers, forming hotspots, and how Moore's law, feature size, and thermal design shape cooling with sensors and materials.
Heat in chips comes from dynamic, static, and short-circuit power; designers use clock gating, power gating, and dynamic voltage scaling to manage heat and heat flux.
Explore heat sink materials and geometry, evaluate thermal resistances from datasheets, and compare aluminum, copper, and synthetic diamonds for effective cooling.
Analyze heat sink thermal resistance from datasheet curves for natural and forced convection by reading temperature rise and power on the appropriate axes; verify with simulations or experiments.
Learn how to select a heat sink for an lm317 regulator dissipating four watts in 35 c ambient, using thermal resistance concepts to keep junction under 125 c.
Assess junction temperature with a heat sink in natural and forced convection to design for 100°C TJ (80% of 125°C max) by computing junction-to-ambient thermal resistances.
Select a fan for a heat sink by matching the fan curve with the system impedance to determine the operating point, and apply thermal interface materials to improve heat transfer.
"Hello everyone, and welcome to the course on Microelectronic Thermal Management. I’m Dr. Anusuya Kathirvel, and I’ll be co-instructing this course along with Dr. S. Manikandan.
This course is designed to help you understand how thermal challenges arise in modern electronics and, more importantly, how we tackle them using engineering principles and practical solutions. You’ll get to explore how heat is generated inside integrated circuits, what happens if it isn’t properly managed, and how we can design components like heat sinks and evaluate junction temperatures and understand the thermal interface materials.
We’ll be blending theory with real-world design case studies—so by the end of the course, you won’t just know the science—you’ll be able to apply it to real-world applications." We will be starting from the fundamentals—like why electronics get hot, how heat flows in and out of chips, and what causes thermal failure. Then we move to real-world systems: heat sinks, fans, thermal interface materials, and advanced cooling techniques. You will also learn how to read datasheets, interpret thermal resistance values, and calculate junction temperatures. The goal is to build your confidence so that by the end of this course, you can select or even design a cooling solution for any electronic device.