Automotive ECU Hardware Design: Architecture & Simulation

In this lecture, you will learn how modern automotive hardware uses intelligent high-side and low-side switches to improve reliability and safety in vehicle power distribution. We explain how MOSFETs and gate drivers replace traditional relays, how high-side and low-side switching differ, and why smart driver ICs are essential for safe and efficient control. By the end, you will understand the fundamentals of driver circuits, protection functions, and their role in ECU hardware design.

This lecture introduces intelligent electronic fuses (E-Fuses) and their advantages over traditional fuses and PTC resistors. You will discover how E-Fuses integrate functions like inrush current limiting, overcurrent and overvoltage protection, reverse polarity protection, and self-repair capabilities. By the end of this lecture, you will be able to explain why E-Fuses are critical for next-generation automotive systems, and how they ensure safety, reliability, and efficiency in premium vehicles.

In this lecture, you’ll learn how power MOSFETs are applied in automotive load switching circuits. We cover their role in replacing traditional relays and fuses, the benefits of MOSFETs for high efficiency and fast switching, and how they handle reverse polarity, inrush current, and protection requirements.

Learning Outcomes:
By the end of this lecture, you will be able to:

• Explain why MOSFETs are preferred over mechanical switches in automotive systems.

• Understand gate drive requirements and switching behavior.

• Identify MOSFET-based solutions for safe and reliable load control in ECUs.

• Recognize practical design considerations for integrating MOSFETs into automotive hardware.

In this lecture, we explore the critical considerations for using MOSFETs in automotive load switch applications. You’ll learn how gate-source voltage (VGS), RDS(on), and inductive load behavior affect efficiency and reliability. We also analyze voltage spikes, Safe Operating Area (SOA) limits, and how to prevent device damage. Using the LTspice SOA-Therm tool, you’ll see how designers evaluate thermal behavior, model PCB and heatsink effects, and ensure robust MOSFET selection for real automotive circuits.

By the end of this lecture, you’ll understand:

• How VGS and RDS(on) impact circuit efficiency.

• The challenges of driving inductive loads and managing voltage spikes.

• Why SOA analysis is critical for safe MOSFET operation.

• How the SOA-Therm tool helps model and validate designs in LTspice.

In this lecture, we explore the dynamic thermal behavior of MOSFETs and how it can be modeled using Foster and Cauer thermal equivalent circuits. You will learn how thermal impedance curves are derived, how RC models capture transient thermal responses, and why accurate thermal modeling is critical for reliable automotive ECU hardware design. We also cover practical techniques with SPICE tools to evaluate junction temperatures, identify thermal risks, and ensure robust performance under demanding load conditions.

What you’ll learn:

• Understand thermal challenges in dense PCB and ECU designs

• The role of thermal impedance (Zth) in MOSFET reliability

• How Foster and Cauer RC models represent device thermal behavior

• Using curve fitting and transient analysis for accurate modeling

• Applying SPICE simulation to predict junction temperatures

In this lecture, you will learn how to model and simulate the thermal behavior of power semiconductors using Foster and Cauer equivalent circuits.
We explain why thermal management is critical in PCB and ECU hardware design, and how Foster models are derived from datasheet parameters. Then, we show how to transform the Foster model into the Cauer model, which more accurately represents the physical thermal behavior of semiconductor devices.

By the end of this lecture, you will:

• Understand the difference between Foster and Cauer thermal models.

• Learn why Cauer networks better capture real-world device behavior.

• See how to model MOSFETs and other power semiconductors in LTspice.

• Prepare for advanced PCB and heatsink thermal simulations.

This module provides essential knowledge for reliable automotive ECU design, where thermal limits directly affect safety, performance, and lifetime.

In this concluding lecture, we summarize the workflow of electrothermal Spice modeling and simulation for power modules. You will revisit the key steps, from extracting thermal impedance curves and fitting Foster models, to transforming them into Cauer networks that represent real physical behavior.

We highlight how to integrate PCB thermal RC models, account for self-heating and cross-coupling effects, and combine thermal and electrical layers into a unified LTSpice simulation. By the end of this lecture, you will understand how to evaluate junction temperatures, power losses, and system-level interactions – all using free tools like LTSpice instead of costly commercial software.

This conclusion also opens the door for advanced topics: building complete electrothermal models for MOSFETs, IGBTs, and eFuse circuits. If you are interested, future updates of the course will explore these methods in even greater detail.

Learn how functional safety shapes the development of electric vehicle inverters and ECUs. This lecture introduces ISO 26262, Automotive Safety Integrity Levels (ASIL A–D), Hazard Analysis and Risk Assessment (HARA), and the creation of safety goals, functional requirements, and safe states. You’ll see how safety concepts translate into technical hardware and software architectures, preparing you to evaluate or design safety-critical systems in line with industry standards.

In this lecture, students will learn how modern vehicle development has evolved from mechanical design to integrated electrical and electronic systems. We will explore the complete systems engineering process — from requirement definition and system architecture to partitioning, component development, and system integration.

You’ll gain a clear understanding of how ECUs, sensors, actuators, and software are organized within vehicle domains, and how tools like AUTOSAR enable standardized communication and hardware-software interoperability across the vehicle’s EE network.

Test your Automotive ECU architecture knowledge with a 34-question engineering assessment. Complete the exam first, then use the fully explained solutions to review the reasoning, architecture context, and engineering logic behind each answer.

Learn how to design and simulate a 48 V brushless DC motor drive for automotive applications. This lecture covers power-stage hardware, filtering, reverse-battery protection, and control-supply generation using real ECU design practices.

Learning Outcome:
Students will be able to analyze and implement a BLDC motor-drive circuit with proper automotive protections and power-supply stages.

Discover how traction inverters convert battery DC power into three-phase AC energy to drive electric vehicle motors. This lecture explains inverter topologies, DC link control, isolation design, and gate-driver bias supplies using real automotive design methods and simulations.

Learning Outcome:
Students will understand traction inverter hardware structure, protection circuits, and isolated driver design for safe and efficient EV motor control.

In this lecture, you will analyze the hardware architecture of an encoderless field-oriented control system for BLDC and permanent-magnet synchronous motors using a pedelec drive as a practical example.

You will learn how the battery supply, three-phase inverter, MOSFETs, gate drivers, voltage and current sensing, microcontroller, and sensorless rotor-position estimation work together as one complete motor-drive system.

By the end of the lecture, you should be able to identify the main hardware blocks of an FOC drive, understand their interaction, and relate the same engineering principles to automotive applications such as electric pumps, fans, compressors, actuators, and other auxiliary motor drives.

The downloadable resources include TINA-TI simulation files and a short TINA-TI installation guide so you can inspect and simulate selected circuit blocks yourself.

In this lecture, you will study the hardware architecture of a battery management system, or BMS, for electric and hybrid vehicles.

The lecture explains how the main BMS hardware blocks work together, including cell-voltage acquisition, current and temperature measurement, passive and active cell balancing, contactor control, communication interfaces, and the digital control core.

You will also see how battery-monitoring integrated circuits are used to supervise large series-connected cell stacks, how daisy-chain communication is implemented, and how battery information is exchanged with other vehicle systems through the can bus.

The lecture also introduces practical hardware considerations for state-of-charge and state-of-health estimation, including the importance of accurate voltage, current, and temperature measurements.

By the end of the lecture, you should be able to identify the major hardware blocks of an automotive BMS, understand their interaction, and relate the design to real electric-vehicle battery packs, traction systems, DC to DC converters, on-board chargers, and vehicle control units.

Explore the hardware architecture of an automotive Body Control Module (BCM), from power supply and protection to MCU interfaces, LED drivers, low-side and high-side switches, external MOSFET drivers, GPIO expansion, and actuator control.

The lecture also connects the conventional BCM architecture to modern body-domain and zonal vehicle architectures, showing how these hardware building blocks continue to support software-defined vehicles and higher-level ADAS/automated-driving systems.

The downloadable resources include a TINA-TI quick-start guide for working with TI simulation models and a BCM-to-zonal architecture guide for further engineering study.