
Explore multidisciplinary thermal management concepts for microelectronics, addressing high power density and cross-disciplinary collaboration, with principles explained systematically for engineers of diverse backgrounds.
Explore electronic thermal management, tracing semiconductor history from vacuum tubes to transistors, and explain heat dissipation, Moore's law, feature size, transistor density, and on-chip switching power.
Examine temperature dependent failures, thermal expansion, and corrosion mechanisms in electronics. Apply the thermal design process, addressing power dissipation, mtbf, airflow, and design verification through UL certification.
Explore air cooling and heat sinks, comparing natural convection with forced cooling, and examine fin spacing, length, width, and mass flow rate to optimize thermal resistance, conduction, convection, and radiation.
Derive the one-dimensional heat conduction equation from a small element's energy balance, incorporating heat generation and thermal diffusivity, and explore steady-state and transient cases for plane walls.
Derive the log mean temperature difference for parallel-flow heat exchangers, define Delta T1 and Delta T2, and show why lmtd outperforms the arithmetic mean for heat transfer.
Welcome to Thermal Management Solutions in Electronics!!
In the introduction part of this course, the trend of semiconductor technology is discussed, and their heating issues are delved deeper.
Our first objective is to develop an understanding of how the heat is being developed in semiconductor level of electronic components and the features that control the heat dissipation. We will discuss the heat conduction concept and the conduction equation, which is necessary for analyzing real time engineering problems, such as steady state, transient state and lumped heat systems. Boundary conditions, heat conduction with and without heat generation are explained in detail.
We then address the problem of reduced performance in heat exchangers and methods to calculate the effectiveness of heat exchangers. The overall heat exchanger coefficient and reason for fouling phenomena are discussed.
Throughout the course, we will explore how to estimate heat transfer to perform analyses on thermal systems experiencing different types of flow conditions and heat transfer situations.
By the end of this course, you will have an enhanced understanding of semiconductors, conduction heat transfer and heat exchangers, enabling you to apply these concepts in real-world scenarios.
We wish you good luck in your learning journey. Enroll now to advance your knowledge of thermal management!