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The Semiconductor Environment - Part 6
Rating: 4.6 out of 5(5 ratings)
39 students

The Semiconductor Environment - Part 6

Part 6: Advanced Semiconductor Materials and Technologies
Last updated 10/2025
English

What you'll learn

  • Gain insights into the factors that limit or enable semiconductor device improvements
  • Learn about cutting edge technologies like EUV lithography, TAIKO, DBG, SD, Advanced Packaging (2.5D, 3D, Interposer, HBM, TSV, UBM, RDL) and more
  • Understand the interdependencies between different technologies
  • Learn about Moore`s law and how this defines semiconductor improvement actions

Course content

1 section16 lectures56m total length
  • Introduction1:12
  • Moore`s law3:55
  • How to increase semiconductor device performance11:20
  • EUV lithography5:00
  • TAIKO4:47
  • DBG (Dicing before grinding)3:08

    Reversing the usual flow, the dbg process half-cuts first and then grinds, reducing backside chipping and blade-induced damage to improve die quality.

  • SD (Stealth dicing)1:08
  • Advanced semiconductor materials (SiC, GaN)4:06
  • Introduction into advanced packaging4:43
  • SoC (System on chip)1:04
  • SiP (System in package) and flip-chip technology1:59

    Explore system in package (sip) and flip-chip technology, the most advanced packaging today, enabling flexible, high-performance connections as Moore's Law slows and interposers, 2.5D packaging, and 3D packaging are leveraged.

  • Interposer2:33
  • 2.5D and 3D packaging1:22
  • WLP (Wafer level packaging)3:26
  • HBM (High bandwidth memory)2:56
  • Key takeaways3:25

Requirements

  • Interest in electronics and semiconductors

Description

Embark on an enlightening journey into the world of semiconductors with our comprehensive 7-part course on Udemy! This meticulously crafted series will equip you with a deep understanding of the semiconductor industry, from its fundamental physics to cutting-edge technologies and business strategies


In Part 1, we'll dive into the "Fundamentals of Semiconductor Physics", unraveling the mysteries of electron behavior, energy bands and the principles that make these miraculous materials work. You'll gain a solid foundation that will serve as the bedrock for your semiconductor knowledge.


Part 2 explores "Semiconductor Business Models", offering invaluable insights into the industry's economic landscape. Learn how companies navigate this high-stakes, fast-paced market and position themselves for success.


Parts 3 and 4 focus on the critical aspects of semiconductor production. In "Hard Production Necessities", you'll discover the intricate processes and equipment required to manufacture these tiny technological marvels. "Auxiliary Production Necessities" will complement this knowledge, covering the supporting systems and infrastructure that enable seamless production.


Part 5 delves into the various "Roles2 within the semiconductor industry. Gain an understanding of the diverse career paths available and the skills required to thrive in this dynamic field.


In Part 6, we'll explore "Advanced Semiconductor Materials and Technologies", keeping you at the forefront of innovation. From novel materials to emerging fabrication techniques, you'll be well-versed in the future of semiconductor technology.


Finally, Part 7 covers "Semiconductor Reliability and Failure Analysis", a crucial aspect of quality control and product improvement. Learn the techniques used to ensure the longevity and performance of semiconductor devices.


By the end of this course, you'll have a comprehensive understanding of the semiconductor environment, from the atomic level to industry-wide trends. Whether you're a student, professional or technology enthusiast, this course will provide you with the knowledge and insights to navigate the fascinating world of semiconductors.

Who this course is for:

  • Newcomers and experts within the semiconductor industry