
We will draw a simple buck converter with LTspice. For now, ideal components will be used.
In this chapter we will use real component models of the LTspice library to make the circuit more realistic.
In this chapter, you will learn how to measure the efficiency of the buck converter in LTspice.
This chapter will teach you how to determine which circuit components are causing the most power loss.
In this chapter you will learn how to maximize the efficiency of a buck converter using a MOSFET instead of a diode.
This chapter explains how to adjust the dead time of the MOSFET in order to maximize efficiency.
We will create a first draft of a High Frequency Buck Converter. This will be the basis for the improvements during the later chapters.
I will show you how to select a new MOSFET for a Design which operates at higher frequencies.
Learn how the gate voltage affects the efficiency of a buck converter at higher switching frequencies.
Learn on what to look for in an inductor when using if for a High Frequency Buck Converter.
This chapter shows you how to verify that your MOSFET is used safely.
Learn how to import type 1 data packages (easiest to import): In this case the manufacturer provides a library file as well as a symbol file.
Learn how to import type 2 data packages: In this case the manufacturer only provides a library file. You can easily create the symbol by using the autognerate feature of LTspice.
Learn how to import type 3 data packages: Those are the same as type 2 data packages, but with the difference that the autogenerated symbols wont show the pin names but instead numbers.
Learn how to import type 4 data packages: Often manufacturers provide encrypted SPICE models, i will show you how to import those.
Learn how to import type 5 data packages: In this cas no SPICE model is available and you have to manually enter data into your circuit. Data can come from the datasheet or excel file or a table.
Learn how to import type 6 data packages: Sometimes the manufacturer has forgot to fix some small errors in their files. I will show you how to fix easy errors in SPICE files.
Learn how to import type 7 data packages: If a manufacturer does not provide detailed data about a component, you can simply ask the manufacturer.
This course will show you how to design a 99% efficient buck converter. It will be 100% hands on instead of using PowerPoint slides.
When using real component models in LTspice, you have to consider many factors during your component selection.
This course will help you to find out which effects are the main causes for a decrease in efficiency of a buck converter.
Following terms will be directly or indirectly covered during this course:
Diode:
* Forward Voltage
* Current Capability
* Breakdown Voltage
* Reverse Current
* Junction Capacitance
MOSFET:
* On Resistance
* Gate Capacitance and Gate Charge as well as other capacitances that influence the switching behavior
* Gate Rise Time and Gate Fall Time
* Switching Frequency
* Dead Time
* Current Conduction via Body Diode
* Gate Driving Requirements
* Safe Operating Area (SOA)
* Shoot-Through Current (Current that flows when High-Side and Low-Side MOSFET are on at the same time)
Capacitor:
* Series Resistance
* Series Inductance
* Parallel Resistance
Inductor:
* Series Resistance
* Series Capacitance
* Parallel Capacitance
Following topics are not being discussed in this course, but are still important for a real world design:
Diode:
* Temperature dependence of Forward Voltage and Current, Reverse Current and Junction Capacitance
* Surge Current capability over Temperature
MOSFET:
* Temperature dependence of all above-mentioned topics
* Variation of Dead time of the Gate Driver (Jitter)
* dV/dt ruggedness of MOSFET (maximum change rate VDS voltage)
* Maximum allowed Power Dissipation over Temperature
* Current Capability of Body Diode
Capacitor:
* Frequency and Temperature dependence of Capacitance
* Temperature dependent allowable Maximum Power Dissipation
* Ripple Current Capability over Temperature
* Aging Effects due to Temperature and ripple current
* Acoustic noise Emission limits (MLCC piezoelectric effect)
Electromagnetic Compatibility:
* Emission Limits
* Immunity Requirements
Regulatory Requirements:
* CE, FCC, ...
* Hazardous Area Requirements
* Laws limiting import and export of Hazardous Substances (e.g. RoHS)