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Hybrid Electronics Enclosure Design with Thermal Simulations
Rating: 3.8 out of 5(5 ratings)
109 students

Hybrid Electronics Enclosure Design with Thermal Simulations

Enclosure Design, Development and Thermal Analysis for Efficient Hybrid (Metal + Plastic) Electronics Housings
Created byNaeem Rahman, Arwa Habib
Last updated 11/2025
English
English [Auto],

What you'll learn

  • What is electronics enclosure
  • what are the challenges and how to overcome challenges while desigining
  • Sketching, Solid Modeling, Assembly & Thermal Simulations
  • Documentation of your design

Explore related topics

Course content

1 section • 13 lectures • 3h 23m total length

  • Introduction1:51

    Explore an electronics enclosure with top and bottom heatsinks, a plastic part that combines them, and fans; learn heat simulations, determine fan counts, and assemble M3 screws and inserts.

  • Clients Requirement and PCB refining5:33

    Align the enclosure design to the client's requirements by focusing thermal management around hot MOSFETs and 100 W TDP, using aluminum plates and a plastic insert, with optional fans.

  • Making Assy File5:09

    Set up an assembly by importing the main pcb, save as a part, and create three central perpendicular planes for precise alignment with enclosure parts to facilitate heat removal.

  • Top Heat Sink Design20:35

    Create a top heat sink for a hybrid electronics enclosure by modeling a top plate, adding fins, and patterning them to fit around the PCB and MOSFET reference.

  • Plastic Part Design18:25

    Create a top plate with holes and fins, then design a matching plastic part to fit between two plates, featuring 2.5 mm thickness and inserts.

  • Plastic Part Design 220:49

    Explore plastic part design 2 in a hybrid electronics enclosure context, focusing on inserts, heat, and soldering, and applying fillets and chamfers for clearance.

  • Bottom Heat Sink Design24:04

    Design the bottom heatsink within the assembly, create edges, extrude features, create countersunk holes for M3 screws, pattern fins, and align screws with the plastic part for a secure assembly.

  • Top Sheet/Cover7:37

    Install a top sheet to flush-fit the enclosure top, offset faces by 0.2 mm for clearance, and add screw holes with a 3.25 mm diameter.

  • Importing and Editing External Cad models and Incorporating in to Assy21:40

    Import and edit external CAD models to fit into the assembly, adding M3 brass inserts and a 16 mm USB‑C panel port, while using Grabcad resources and SolidWorks workflows.

  • Editing Geometry for thermal Simulation11:27

    Edit the enclosure geometry for thermal simulation, assign 300 W of heat to MOSFET contacts, split faces for accurate input, and compare cooling options like fins or fans.

  • Thermal Simulation15:03

    Conduct a thermal simulation in SolidWorks to assess a 300 W heat load on the enclosure. Compare natural versus forced convection and fan sizing to keep temperatures under 60 C.

  • Importing Fans27:05

    Explore selecting 40x40 mm fans for a heatsink, achieving max air circulation to cool mosfets, while sizing the heatsink and placing four fans in a symmetric layout.

  • Adding Fasteners24:19

    Master the assembly of a hybrid electronics enclosure by adding fan grills, mounting M3 screws, and patterning fasteners for precise PCB mounting and bill of materials readiness.

Requirements

  • Just the basic knowledge of Sildworks

Description

Take your SolidWorks skills to the next level with a complete, hands-on project — designing a hybrid electronics enclosure that combines 3D-printed plastic components with aluminum heat sinks for superior cooling and performance.

In this course, you’ll learn every step of the design process, from the first sketch to final assembly and thermal simulation. You’ll model every detail in SolidWorks, understand how to combine plastic and metal parts effectively, and use thermal simulation tools to make design decisions backed by data.

The project centers on creating a functional, high-efficiency enclosure for electronic components. The top and bottom aluminum heat sinks handle heat dissipation, while a custom 3D-printed plastic body provides structure, alignment, and housing for all internal parts. You’ll also integrate cooling fans as per simulation results to achieve optimal airflow and thermal balance.

Whether you’re a student, engineer, or product designer, this course will strengthen your understanding of SolidWorks modeling, assembly creation, and simulation techniques while introducing real-world design practices used in the electronics industry.

What you’ll learn:

  • Complete workflow of SolidWorks modeling and assembly design

  • Designing hybrid enclosures using aluminum and plastic materials

  • Creating parametric 3D models and complex geometry

  • Top to down modeling and assembling techniques

  • Setting up thermal simulations and analyzing heat transfer

  • Designing and positioning fans based on simulation data

  • Generating manufacturing drawings and preparing models for FDM 3D printing

  • Understanding real-world thermal management in electronic enclosures

Why take this course:
This isn’t just another SolidWorks tutorial — it’s a professional-level project that demonstrates how to design with both functionality and manufacturability in mind. You’ll gain the confidence to work on real engineering problems, build a portfolio-ready project, and learn the workflow engineers use to bring thermal-efficient enclosures to life.

Join now and start designing hybrid electronics enclosures that are not only innovative and aesthetic but also optimized for real-world performance.

Who this course is for:

  • Mechanical Engineers
  • Designers

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