High-Speed Board Design Course System On Module -EsteemPCB

Access and review the section two documents, images, and project files, including DDR4 SDRAM datasheets, Lpx documents, updated device documents, DDR controller comparisons, and quizzes.

Explore key concepts of DDR3, DDR4, LPDDR3, and LPDDR4, including data groups, topologies between memory and the processor, and bandwidth considerations.

Identify the four signal groups for ddr interfaces—data, address and command, control, and clock—used in lpddr4 systems, including dq, dqs, dm, css, cke, and termination considerations.

Explore direct 1-to-1 topology for dqs and dq connections and flyback and t connections, highlighting skew, length matching, and the relation between clock frequency, data rate, and bandwidth in ddr.

Explore the rk3399 datasheet, detailing memory options (ddr3, lpddr4, emmc, spi nor/nand, sdmc), boot roms, and key peripherals (co-processors, pll, power, gpu, camera interfaces, usb, ethernet, pci).

Explore a practical Pugh matrix-based procedure to select LPDDR4 SDRAM for mobile applications, verify compatibility via datasheet, and define voltage, clock, density, and bandwidth considerations for a 2 gigabyte requirement.

Explore section 3 contents for high-speed board design: download the zip with datasheets for lp ddr4 sdram and emc, project files, quizzes, images, and assignment 1.

Learn soft and hard memory resets, explore sdram vendor demos, and build a Pugh matrix to compare LPDDR4 sdram features and eMMC considerations for a two-channel design.

Read the LPDDR4 datasheet and JESD209-4 to map a two-channel, two-rank memory with 16-bit data per channel, detailing DQ, DCS, DMI, command/address, clocking, on-determination, ZQ, and power rails.

Design LPDDR4 schematic in Altium, mapping two channels with data bits D zero through D 31, data strobe DQS, data mask DM, address lines and clocks, using verified libraries.

Explore practical schematic design for a LPDDR4 DDR memory system, detailing rank connections, VDC and VSS grounding, ZQ references, and bypass capacitor strategies using MLCCs and 0603/0402 packages.

Download and extract the section four zip to access assignments, datasheets, IEEE 802.11 2.1 standards image, EMC 5.1 specs, Wi‑Fi module datasheets, and a practice project with quizzes.

Explain what eMMC is, its three blocks (flash memory, memory card, and controller), how to select an eMMC chip using JESD84-B51 5.1, and NAND versus NOR types.

Examine SLC, MLC, TLC, and QLC block representations, compare data-rate multipliers and costs at 200 MHz, and complete assignment two to create an EMMC Pugh matrix with voltages and density.

Select the 16 GB Samsung emmc, review 1.7–1.95 V interface and 2.7–3.6 V supply, map pins, and draft a multi-page schematic with decoupling capacitors and reserved pins.

Explore WLAN fundamentals and selection criteria for Wi‑Fi modules, covering standards (802.11), operating bands, data rate versus throughput, security, interfaces, drivers, antennas, and certification considerations.

This lecture guides reading the wf60 wifi module datasheet, covering dual-band 2.4/5 ghz, sdio and spi interfaces, power and voltage needs, and key certifications (fcc, ic, ce).

Download section five zip to access folders containing a wifi and bluetooth module data sheet, CTS signals, assignment 3, and a project file with solutions for assignments 1 and 2.

Build the Wi-Fi 60 module schematic from the datasheet, outlining power blocks and pins for 3.3v and 1.8v. Illustrate diagrams in Altium, place clock, level shifter, regulators, and antenna interface.

Learn how to read the AP6356 wifi module datasheet, evaluate power architecture with multiple regulators, and optimize BOM and plane layouts for high-speed system-on-module boards.

Explain schematic design of VDD_GPU, VDD_BIGCPU, VDD_LITCPU, and VDD_LOG blocks on a high-speed board, covering pin mapping, block sectioning, and capacitor placement per guidelines.

Explore the schematic design of the RK3399 LPDDR4 DDR controller, covering channel wiring, net naming, clocks, and DDR zero and DDR one data, mask, strobe signals.

Download section six zip to access the data sheet and design guidelines, plus documents and animations; learn pin configurations, voltages, frequencies, and interface pin counts for adc and signal types.

Map RK3399 pins from the processor datasheet in an Excel sheet, design schematic blocks, and select buck converters and bypass capacitors per design guidelines to create a system-on-module power supply.

Map ddr1 and ddr0 pins from the rk3399 datasheet, highlight embedded reference circuits, discuss emc requirements, and plan power up sequencing via pmic for high-speed board design.

Explore RK3399 high-speed interfaces, covering PCI Express 2.1 details, ADC/DAC concepts, HDMI and MIPI display/camera interfaces, and USB-C carrier board considerations.

Explore RK3399 interfaces and schematic design considerations including MIPI CSI, ethernet mac with RGMII, and GPIO/pin assignments, with emphasis on supply pins and interface discussions.

Download the zip, extract it, and study the lvds and sdio images and documents, plus the Altium Designer project file, assignment four, and the datasheet and updated device dock documents.

Examine I2C and SPI interfaces: a two-wire synchronous bus with masters and slaves, pull-ups and load capacitance limits, versus SPI’s four-wire fast, stream data and chain/point-to-point configurations.

Explain uart as universal asynchronous receiver and transmitter enabling 1-to-1 serial communication, and clarify lvds as a low-voltage differential signaling standard for high-speed, low-noise interfaces with termination.

Learn the I2S interface: data, word select, and clock signals, master–slave roles, and channel selection. Compare SDIO and its clocking, data lines, and practical data rate ranges for modern devices.

Explore ethernet hardware interfaces from mii to xgmii, including rmii, gmii, and rgmii, and learn how data rates, clocks, and mac addresses relate to the data-link and physical layers.

Explore USB 2.0 basics, including host-device data transfer, power delivery, and differential signals, then examine Type-C with CC pins and alternate modes for debugging, video, and CAMIF.

Download the section eight zip to access updated device documents, four, six, ten, and twelve layer stackups, pMic blocks, Ethernet datasheet, and soft start and load switch details.

design the schematic for the RK3399 PMU system block, covering ethernet PHY schematic, clock and reset circuits, EFUSE protection, a 1.8 v regulator, and PMU GPIOs on the 260-pin interface.

Apply a Pugh matrix to select a PMIC RK808 and design power supply blocks, detailing Type-C power tree, buck converters, LDOs, sequencing, and integration with a SOM carrier board.

Explore schematic design of the PMIC, buck converters, and Ethernet PHY, including boot sequencing, power rails, Type-C connector integration, and verification against datasheets.

Explore soft-start circuit design with load switches and RC-gated MOSFETs, analyze inrush control, and implement a DDR4 260-pin connector schematic using vendor references.

Discuss layer stackup strategies for high-speed boards, compare four-layer, six-layer, and multi-layer configurations, and learn to simulate with Hyper Linux and mail manufacturers for verification.

Explore section nine documents and download the zip with two project files, 12-layer stackup images, and library; practice placement planning, impedance tables, and updated dxf files for the final board.

Learn to implement a 12-layer stackup in Altium Designer, export the dxf outline, set up prepreg and core materials, plan placement and high-speed routing, and validate manufacturability with vendors.

Import a dxf file to define the pcb outline and board shape, set shielding and fiducials, configure a ddr4 connector layout, and import components via footprint manager.

Plan system-on-module board placement by listing nine blocks—from lpddr4 and emc to pMic and buck converters—then compare two placements to optimize high-speed routing on an eight-layer board.

Place the big components first, verify alignment with markers, set 45-degree rotation, apply design rules, color nets, and add fiducials and mounting holes to guide routing.

Place a system-on-chip on the correct layer, arrange bypass capacitors to ground, and define net classes for 50 ohm single-ended and 100 ohm differential impedance with routing tips.

Download section ten resources zip, extract it to access a nested zip containing the Som board project for assignments six and seven, and download documents before starting section ten.

Apply detailed component placement under the system-on-chip, configure differential pair net classes, and group signals by impedance to meet DDR4 and LPDDR4 guidelines, referencing assignment 6 and 7.

Master practical placement of pMic and regulators, LPDDR4 SDRAM bypass capacitors, edge layout with symmetric distribution for byte groups, and note type-c, Wi‑Fi, EMC, and phi constraints.